APAC Wi-Fi Chipset Market Share, Trends, Demand, Revenue, Growth Drivers, Challenges, Key Manufacturers and Business Opportunities Till 2033

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APAC Wi-Fi Chipset Market Share, Trends, Demand, Revenue, Growth Drivers, Challenges, Key Manufacturers and Business Opportunities Till 2033: SPER Market Research



 Published: Aug-2024
 Author: SPER Analyst


Asia Pacific Wi-Fi Chipset Market is projected to be worth USD 8919.14 million by 2033 and is anticipated to surge at a CAGR of 3.45%.

A wireless networking technology called a Wi-Fi chipset provides a network connection for data transmission as well as wireless high-speed internet. It is utilised for internet access and local area networking of devices. An essential component of Wi-Fi routers and other linked devices is the Wi-Fi chipset. The demand for Wi-Fi chipsets is rising globally as a result of the internet's and smart devices' expanding penetration as well as the world's rapid digitization. These chipsets are also being used in smart home appliances including air conditioners, water heaters, washing machines, and televisions due to the growth of Internet of Things (IoT) applications.

Asia Pacific Wi-Fi Chipset Market Driving Factors and Challenges

Drivers: The increasing acceptance of IoT, rising globalisation, and the growing number of public Wi-Fi hotspots around the world will emerge as important drivers of market growth. Furthermore, the growing number of small-scale enterprises seeking to implement high-speed network connectivity, as well as the increasing penetration of consumer electronic gadgets such as smartphones, laptops, and others, will exacerbate market value. Wi-Fi technology has grown in popularity as smartphones become more widespread around the world. Voice-Over Mobile Broadband (VOMBB) attracts more customers than traditional telecom carriers because to its low cost, good audio quality, and power preservation capabilities, which also increases demand for Wi-Fi services.

Challenges:
Reduced PC and tablet shipments
The increased performance of phablets and declining smartphone prices are likely to have a major impact on the shipment of PCs and tablets, even with the rise of the consumer electronics market as a whole. The rising number of smartphone shipments in this area is mostly due to China's low-cost smartphone manufacturing. Consumers in Asia Pacific's emerging nations who are cost conscious choose phablets over pricey tablets. In addition, compared to smartphones, tablets and PCs require more frequent replacements. The market for PCs and tablets is growing less as a result of this.


Impact of COVID-19 on Asia Pacific Wi-Fi Chipset Market
The epidemic has caused the market to undergo extraordinary changes. It has hampered company operations and disrupted supply chains due to a scarcity of raw materials and labour. Furthermore, the temporary closure of electronic retail stores has hampered the sale of new Wi-Fi 6 enabled devices, thus impacting the Wi-Fi chipset market. Furthermore, due to short-term factory shutdowns, supply chain disruptions, and a lack of linked product availability, the IoT connection market is expected to have an 18% reduction in net device additions in 2020. As a result, Wi-Fi 5 continues to dominate the market, and it will be another 4-5 years before Wi-Fi 6 replaces it.

Asia Pacific Wi-Fi Chipset Market Key Players:
The market study provides market data by competitive landscape, revenue analysis, market segments and detailed analysis of key market players are; Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO, LTD, Broadcom, Hitachi, Cisco Systems, Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics.


Asia Pacific Wi-Fi Chipset Market Segmentation:

By Device: Based on the Device, Asia Pacific Wi-Fi Chipset Market is segmented as; Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others.

By Band: Based on the Band, Asia Pacific Wi-Fi Chipset Market is segmented as; Single Band, Dual Band, Tri Band.

By Fabrication Technology: Based on the Fabrication Technology, Asia Pacific Wi-Fi Chipset Market is segmented as; FinFET, FDSOI CMOS, Silicon on Insulator, Sige.

By Wi-Fi Standard: Based on the Wi-Fi Standard, Asia Pacific Wi-Fi Chipset Market is segmented as; 802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others.

By MIMO Configuration: Based on the MIMO Configuration, Asia Pacific Wi-Fi Chipset Market is segmented as; MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, SU-MIMO, 3x3 MU-MIMO, 2x2 MU-MIMO, 1x1 MU-MIMO.

By End User: Based on the End User, Asia Pacific Wi-Fi Chipset Market is segmented as; Consumer, Automotive and Transportation, Healthcare, Education, BFSI, Travel and Hospitality, Others.

By Region: This research includes data for China, Japan, India, South Korea, Australia, Indonesia, Others.

This study also encompasses various drivers and restraining factors of this market for the forecast period. Various growth opportunities are also discussed in the report.

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