Asia Pacific Wi-Fi Chipset Market Growth, Size, Trends, Demand, Share, Revenue and Future Outlook
Asia Pacific Wi-Fi Chipset Market Size- By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User- Regional Outlook, Competitive Strategies and Segment Forecast to 2033
| Published: Aug-2024 | Report ID: IACT24150 | Pages: 1 - 157 | Formats*: |
| Category : Information & Communications Technology | |||
Asia Pacific Wi-Fi Chipset Market Introduction and Overview
According to SPER Market Research, the Asia Pacific Wi-Fi Chipset Market is estimated to reach USD 8919.14 million by 2033 with a CAGR 3.45%.
The report includes an in-depth analysis of the Asia Pacific Wi-Fi Chipset Market, including market size and trends, product mix, distribution channels, and supplier analysis. A system-on-chip (SoC) or hardware communication module that enables wireless communication between devices is called a Wi-Fi chipset. Wireless (Wi-Fi) chipsets are widely used in hardware components such external wireless local area network (WLAN) cards and WLAN adapters. Furthermore, Wi-Fi chipsets are widely utilised in a variety of devices, including laptops, personal computers, and cellphones. Single, dual, and tri bands are the three operational bands that are frequently offered by Wi-Fi chipsets.
- The Wi-Fi Alliance formally launched the Wi-Fi CERTIFIED 7 programme in January 2024, allowing end-user devices such as smartphones, following the introduction of several chips and devices that enabled Wi-Fi 7. Consequently, "Wi-Fi 7 ready" devices will now have the official ability to support the new standard.
- In October 2022, Aglobal, a global leader in IoT platforms and cloud computing solutions, and MediaTek, a chip maker, formed a strategic cooperation to deliver 5G and Wi-Fi router solutions.
Market Opportunities and Challenges
Opportunities:
Wi-Fi adoption for their networking requirements - The proliferation of smart devices and the Internet of Things has led to an increase in the number of linked devices. Reliable communication is essential for these gadgets, which range from laptops and smartphones to industrial gear and smart home products. Due to Wi-Fi's speed, versatility, and interoperability, it is now the norm when it comes to connecting different devices. In terms of networking, Wi-Fi is less expensive and more expandable than traditional choices such as Ethernet. By avoiding the need for costly cabling infrastructure, Wi-Fi networks facilitate growth and flexibility. For every type of organisation, from small startups to large conglomerates, Wi-Fi is a desirable substitute.
Challenges:
The range of Wi-Fi signals is constrained, particularly at higher frequencies - It is crucial to comprehend that Wi-Fi operates in the radio frequency (RF) spectrum, typically in the 2.4 and 5 GHz bands. These frequencies are ideal for wireless communication since they can partially pass through obstacles like walls. The shorter wavelengths of higher frequencies, like those in the 5 GHz range, impose limitations on them. Wi-Fi signals fade faster via walls, furniture, and the atmosphere because higher frequencies are more likely to cause attenuation. The phenomena arises from the heightened capacity of these obstacles to both absorb and scatter higher frequency signals, hence reducing the effective range of the Wi-Fi signal.
Market Competitive Landscape
The Asia-Pacific Wi-Fi Chipset market competitive landscape includes information on competitors. Details include the company's overview, financials, revenue generated, market potential, investment in R&D, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, and application dominance. Key market players are Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO, LTD, Broadcom, Hitachi, Cisco Systems, Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, ST Microelectronics.
Scope of the Report:
| Report Metric | Details |
| Market size available for years | 2020-2033 |
| Base year considered | 2023 |
| Forecast period | 2024-2033 |
| Segments covered | By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User |
| Regions covered | China, Japan, India, South Korea, Australia, Indonesia, Others |
| Companies Covered | Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO. LTD, Broadcom, Hitachi, Cisco Systems. Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics. |
COVID-19 Impact on Asia Pacific Wi-Fi Chipset Market
The Wi-Fi chipset market was seeing substantial growth prior to the COVID-19 outbreak as a result of the introduction of Wi-Fi 6 and IEEE 802.11 ay, since crucial new capabilities enable Wi-Fi 6 networks and devices to handle high traffic easily and efficiently. The new standard allows more client devices, and significantly more IoT devices, to function freely on the network. It permits the transmission of additional audio, video, and other real-time data. Furthermore, the technology was used in a variety of devices, including the Samsung Galaxy S10, Note 10, iPhone 11, and iPhone 11 Pro. These deployments accelerated market growth prior to COVID-19. The epidemic has caused the market to undergo extraordinary changes. It has hampered company operations and disrupted supply chains due to a scarcity of raw materials and labour. Furthermore, the temporary closure of electronic retail stores has hampered the sale of new Wi-Fi 6 enabled devices, thus impacting the Wi-Fi chipset market. Furthermore, due to short-term factory shutdowns, supply chain disruptions, and a lack of linked product availability, the IoT connection market is expected to have an 18% reduction in net device additions in 2020. As a result, Wi-Fi 5 continues to dominate the market, and it will be another 4-5 years before Wi-Fi 6 replaces it.
Key Target Audience:
- Telecommunications Companies
- Consumer Electronics Manufacturers
- Automotive Industry
- Internet of Things (IoT) Device Manufacturers
- Networking Equipment Manufacturers
- Enterprise Sector
- Healthcare Sector
- Retail and E-commerce
- Educational Institutions
- Public Sector and Government Agencies
Our in-depth analysis of the Asia Pacific Wi-Fi Chipset Market includes the following segments:
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| By Band: |
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| By Fabrication Technology: |
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| By Wifi Standard: |
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| By MIMO Configuration: |
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| By End User: |
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Key Topics Covered in the Report:
- Asia Pacific Wi-Fi Chipset Market Size (FY’2024-FY’2033)
- Overview of Asia Pacific Wi-Fi Chipset Market
- Segmentation of Asia Pacific Wi-Fi Chipset Market By Device (Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others)
- Segmentation of Asia Pacific Wi-Fi Chipset Market By Band (Single Band, Dual Band, Tri Band)
- Segmentation of Asia Pacific Wi-Fi Chipset Market By Fabrication Technology (FinFET, FDSOI CMOS, Silicon On Insulator, Sige)
- Segmentation of Asia Pacific Wi-Fi Chipset Market By Wi-Fi Standard (802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others)
- Segmentation of Asia Pacific Wi-Fi Chipset Market By MIMO Configuration (MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, SU-MIMO, 3x3 MU-MIMO, 2x2 MU-MIMO, 1x1 MU-MIMO)
- Segmentation of Asia Pacific Wi-Fi Chipset Market By End User (Consumer, Automotive and Transportation, Healthcare, Education, BFSI, Travel and Hospitality, Others)
- Statistical Snap of Asia Pacific Wi-Fi Chipset Market
- Expansion Analysis of Asia Pacific Wi-Fi Chipset Market
- Problems and Obstacles in Asia Pacific Wi-Fi Chipset Market
- Competitive Landscape in the Asia Pacific Wi-Fi Chipset Market
- Impact of COVID-19 and Demonetization on Asia Pacific Wi-Fi Chipset Market
- Details on Current Investment in Asia Pacific Wi-Fi Chipset Market
- Competitive Analysis of Asia Pacific Wi-Fi Chipset Market
- Prominent Players in the Asia Pacific Wi-Fi Chipset Market
- SWOT Analysis of Asia Pacific Wi-Fi Chipset Market
- Asia Pacific Wi-Fi Chipset Market Future Outlook and Projections (FY’2024-FY’2033)
- Recommendations from Analyst
1. Introduction
1.1. Scope of the report1.2. Market segment analysis
2. Research Methodology
2.1. Research data source
2.1.1. Secondary Data2.1.2. Primary Data2.1.3. SPER’s internal database2.1.4. Premium insight from KOL’s
2.2. Market size estimation
2.2.1. Top-down and Bottom-up approach
2.3. Data triangulation
3. Executive Summary
4. Market Dynamics
4.1. Driver, Restraint, Opportunity and Challenges analysis
4.1.1. Drivers4.1.2. Restraints4.1.3. Opportunities4.1.4. Challenges
4.2. COVID-19 Impacts of the Asia Pacific Wi-Fi Chipset Market
5. Market variable and outlook
5.1. SWOT Analysis
5.1.1. Strengths5.1.2. Weaknesses5.1.3. Opportunities5.1.4. Threats
5.2. PESTEL Analysis
5.2.1. Political Landscape5.2.2. Economic Landscape5.2.3. Social Landscape5.2.4. Technological Landscape5.2.5. Environmental Landscape5.2.6. Legal Landscape
5.3. PORTER’s Five Forces
5.3.1. Bargaining power of suppliers5.3.2. Bargaining power of buyers5.3.3. Threat of Substitute5.3.4. Threat of new entrant5.3.5. Competitive rivalry
5.4. Heat Map Analysis
6. Competitive Landscape
6.1. Asia Pacific Wi-Fi Chipset Market Manufacturing Base Distribution, Sales Area, Product Type6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Asia Pacific Wi-Fi Chipset Market
7. Asia Pacific Wi-Fi Chipset Market, By Device (USD Million) 2020-2033
7.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2020-20267.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2027-20337.3. Tablet7.4. Connected Home Devices7.5. Smartphones7.6. PCS7.7. Access Point Equipment7.8. Others
8. Asia Pacific Wi-Fi Chipset Market, By Band (USD Million) 2020-2033
8.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2020-20268.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2027-20338.3. Single Band8.4. Dual Band8.5. Tri Band
9. Asia Pacific Wi-Fi Chipset Market, By Fabrication Technology (USD Million) 2020-2033
9.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2020-20269.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2027-20339.3. Finfet9.4. FDSOI CMOS9.5. Silicon on Insulator9.6. Sige
10. Asia Pacific Wi-Fi Chipset Market, By Wifi Standard (USD Million) 2020-2033
10.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2020-202610.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2027-203310.3. 802.11AY10.4. 802.11AD10.5. 802.11AX10.6. 802.11AC10.7. WAVE 110.8. 802.11AC10.9. WAVE 210.10. 802.11B10.11. 802.11G10.12. 802.11N
11. Asia Pacific Wi-Fi Chipset Market, By MIMO Configuration (USD Million) 2020-2033
11.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2020-202611.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2027-203311.3. SU-MIMO11.4. MU-MIMO11.5. 1X1 MU-MIMO11.6. 2X2 MU-MIMO11.7. 3X3 MU-MIMO11.8. 4X4 MU-MIMO11.9. 8X8 MU-MIMO
12. Asia Pacific Wi-Fi Chipset Market, By End User (USD Million) 2020-2033
12.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2020-202612.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2027-203312.3. Consumer12.4. Automotive12.5. Transportation12.6. Healthcare12.7. Education12.8. BFSI12.9. Travel12.10. Hospitality12.11. Others
13. Asia Pacific Wi-Fi Chipset Market Forecast, 2020-2033 (USD Million)
13.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share
14. Asia Pacific Wi-Fi Chipset Market, By Region, 2020-2033 (USD Million)
14.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2020-2026)14.2. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2027-2033)14.3. China14.4. Japan14.5. India14.6. South Korea14.7. Australia14.8. Indonesia14.9. Others
15. Company Profile
15.1. Intel Corporation
15.1.1. Company details15.1.2. Financial outlook15.1.3. Product summary15.1.4. Recent developments
15.2. Qualcomm Technologies. Inc
15.2.1. Company details15.2.2. Financial outlook15.2.3. Product summary15.2.4. Recent developments
15.3. ESPRESSIF SYSTEMS (SHANGHAI) CO LTD
15.3.1. Company details15.3.2. Financial outlook15.3.3. Product summary15.3.4. Recent developments
15.4. Broadcom
15.4.1. Company details15.4.2. Financial outlook15.4.3. Product summary15.4.4. Recent developments
15.5. Hitachi
15.5.1. Company details15.5.2. Financial outlook15.5.3. Product summary15.5.4. Recent developments
15.6. Cisco Systems, Inc
15.6.1. Company details15.6.2. Financial outlook15.6.3. Product summary15.6.4. Recent developments
15.7. Microsoft
15.7.1. Company details15.7.2. Financial outlook15.7.3. Product summary15.7.4. Recent developments
15.8. Apple Inc
15.8.1. Company details15.8.2. Financial outlook15.8.3. Product summary15.8.4. Recent developments
15.9. Celeno Communications
15.9.1. Company details15.9.2. Financial outlook15.9.3. Product summary15.9.4. Recent developments
15.10. Taiwan Semiconductor Manufacturing Company Limited
15.10.1. Company details15.10.2. Financial outlook15.10.3. Product summary15.10.4. Recent developments
15.11. STMicroelectronics
15.11.1. Company details15.11.2. Financial outlook15.11.3. Product summary15.11.4. Recent developments
15.12. Others
16. Conclusion
17. List of Abbreviations
18. Reference Links
SPER Market Research’s methodology uses great emphasis on primary research to ensure that the market intelligence insights are up to date, reliable and accurate. Primary interviews are done with players involved in each phase of a supply chain to analyze the market forecasting. The secondary research method is used to help you fully understand how the future markets and the spending patterns look likes.
The report is based on in-depth qualitative and quantitative analysis of the Product Market. The quantitative analysis involves the application of various projection and sampling techniques. The qualitative analysis involves primary interviews, surveys, and vendor briefings. The data gathered as a result of these processes are validated through experts opinion. Our research methodology entails an ideal mixture of primary and secondary initiatives.
Frequently Asked Questions About This Report
Asia Pacific Wi-Fi Chipset Market is projected to reach USD 8919.14 million by 2033, growing at a CAGR of 3.45% during the forecast period.
Asia Pacific Wi-Fi Chipset Market grew in Market size from 2024. The Market is expected to reach USD 8919.14 million by 2033, at a CAGR of 3.45% during the forecast period.
Asia Pacific Wi-Fi Chipset Market CAGR of 3.45% during the forecast period.
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Asia Pacific Wi-Fi Chipset Market size is USD 8919.14 million from 2024 to 2033.
Asia Pacific Wi-Fi Chipset Market is covered By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User.
The Asia-Pacific is anticipated to have the highest Market share in the Asia Pacific Wi-Fi Chipset Market.
The key players in the Market include Companies Covered Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO, LTD, Broadcom, Hitachi, Cisco Systems, Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics.
A system-on-chip (SoC) or hardware communication module that enables wireless communication between devices is called a Wi-Fi chipset. Wireless (Wi-Fi) chipsets are widely used in hardware components such external wireless local area network (WLAN) cards and WLAN adapters.
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