Asia Pacific Wi-Fi Chipset Market Growth, Size, Trends, Demand, Share, Revenue and Future Outlook: SPER Market Research

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Published: Aug 2024	Report ID: IACT24150	Pages: 1 - 157	Formats^*:
Category : Information & Communications Technology

Asia Pacific Wi-Fi Chipset Market Introduction and Overview

According to SPER Market Research, the Asia Pacific Wi-Fi Chipset Market is estimated to reach USD 8919.14 million by 2033 with a CAGR 3.45%.

The report includes an in-depth analysis of the Asia Pacific Wi-Fi Chipset Market, including market size and trends, product mix, distribution channels, and supplier analysis. A system-on-chip (SoC) or hardware communication module that enables wireless communication between devices is called a Wi-Fi chipset. Wireless (Wi-Fi) chipsets are widely used in hardware components such external wireless local area network (WLAN) cards and WLAN adapters. Furthermore, Wi-Fi chipsets are widely utilised in a variety of devices, including laptops, personal computers, and cellphones. Single, dual, and tri bands are the three operational bands that are frequently offered by Wi-Fi chipsets.

The Wi-Fi Alliance formally launched the Wi-Fi CERTIFIED 7 programme in January 2024, allowing end-user devices such as smartphones, following the introduction of several chips and devices that enabled Wi-Fi 7. Consequently, "Wi-Fi 7 ready" devices will now have the official ability to support the new standard.

In October 2022, Aglobal, a global leader in IoT platforms and cloud computing solutions, and MediaTek, a chip maker, formed a strategic cooperation to deliver 5G and Wi-Fi router solutions.

Market Opportunities and Challenges

Opportunities:

Wi-Fi adoption for their networking requirements - The proliferation of smart devices and the Internet of Things has led to an increase in the number of linked devices. Reliable communication is essential for these gadgets, which range from laptops and smartphones to industrial gear and smart home products. Due to Wi-Fi's speed, versatility, and interoperability, it is now the norm when it comes to connecting different devices. In terms of networking, Wi-Fi is less expensive and more expandable than traditional choices such as Ethernet. By avoiding the need for costly cabling infrastructure, Wi-Fi networks facilitate growth and flexibility. For every type of organisation, from small startups to large conglomerates, Wi-Fi is a desirable substitute.

Challenges:

The range of Wi-Fi signals is constrained, particularly at higher frequencies - It is crucial to comprehend that Wi-Fi operates in the radio frequency (RF) spectrum, typically in the 2.4 and 5 GHz bands. These frequencies are ideal for wireless communication since they can partially pass through obstacles like walls. The shorter wavelengths of higher frequencies, like those in the 5 GHz range, impose limitations on them. Wi-Fi signals fade faster via walls, furniture, and the atmosphere because higher frequencies are more likely to cause attenuation. The phenomena arises from the heightened capacity of these obstacles to both absorb and scatter higher frequency signals, hence reducing the effective range of the Wi-Fi signal.

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Market Competitive Landscape

The Asia-Pacific Wi-Fi Chipset market competitive landscape includes information on competitors. Details include the company's overview, financials, revenue generated, market potential, investment in R&D, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, and application dominance. Key market players are Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO, LTD, Broadcom, Hitachi, Cisco Systems, Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, ST Microelectronics.

Scope of the Report:

Report Metric	Details
Market size available for years	2020-2033
Base year considered	2023
Forecast period	2024-2033
Segments covered	By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User
Regions covered	China, Japan, India, South Korea, Australia, Indonesia, Others
Companies Covered	Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO. LTD, Broadcom, Hitachi, Cisco Systems. Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics.

COVID-19 Impact on Asia Pacific Wi-Fi Chipset Market

The Wi-Fi chipset market was seeing substantial growth prior to the COVID-19 outbreak as a result of the introduction of Wi-Fi 6 and IEEE 802.11 ay, since crucial new capabilities enable Wi-Fi 6 networks and devices to handle high traffic easily and efficiently. The new standard allows more client devices, and significantly more IoT devices, to function freely on the network. It permits the transmission of additional audio, video, and other real-time data. Furthermore, the technology was used in a variety of devices, including the Samsung Galaxy S10, Note 10, iPhone 11, and iPhone 11 Pro. These deployments accelerated market growth prior to COVID-19. The epidemic has caused the market to undergo extraordinary changes. It has hampered company operations and disrupted supply chains due to a scarcity of raw materials and labour. Furthermore, the temporary closure of electronic retail stores has hampered the sale of new Wi-Fi 6 enabled devices, thus impacting the Wi-Fi chipset market. Furthermore, due to short-term factory shutdowns, supply chain disruptions, and a lack of linked product availability, the IoT connection market is expected to have an 18% reduction in net device additions in 2020. As a result, Wi-Fi 5 continues to dominate the market, and it will be another 4-5 years before Wi-Fi 6 replaces it.

Key Target Audience:

Telecommunications Companies
Consumer Electronics Manufacturers
Automotive Industry
Internet of Things (IoT) Device Manufacturers
Networking Equipment Manufacturers
Enterprise Sector
Healthcare Sector
Retail and E-commerce
Educational Institutions
Public Sector and Government Agencies

Our in-depth analysis of the Asia Pacific Wi-Fi Chipset Market includes the following segments:

By Device:	Tablet Connected Home Devices Smartphones PCS Access Point Equipment Others
By Band:	Single Band Dual Band Tri Band
By Fabrication Technology:	Finfet FDSOI CMOS Silicon on Insulator Sige
By Wifi Standard:	802.11AY 802.11AD 802.11AX 802.11AC WAVE 1 802.11AC WAVE 2 802.11B 802.11G 802.11N
By MIMO Configuration:	SU-MIMO MU-MIMO 1X1 MU-MIMO 2X2 MU-MIMO 3X3 MU-MIMO 4X4 MU-MIMO 8X8 MU-MIMO
By End User:	Consumer Automotive Transportation Healthcare Education BFSI Travel Hospitality Others

Key Topics Covered in the Report:

Asia Pacific Wi-Fi Chipset Market Size (FY’2024-FY’2033)
Overview of Asia Pacific Wi-Fi Chipset Market
Segmentation of Asia Pacific Wi-Fi Chipset Market By Device (Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others)
Segmentation of Asia Pacific Wi-Fi Chipset Market By Band (Single Band, Dual Band, Tri Band)
Segmentation of Asia Pacific Wi-Fi Chipset Market By Fabrication Technology (FinFET, FDSOI CMOS, Silicon On Insulator, Sige)
Segmentation of Asia Pacific Wi-Fi Chipset Market By Wi-Fi Standard (802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others)
Segmentation of Asia Pacific Wi-Fi Chipset Market By MIMO Configuration (MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO, SU-MIMO, 3x3 MU-MIMO, 2x2 MU-MIMO, 1x1 MU-MIMO)
Segmentation of Asia Pacific Wi-Fi Chipset Market By End User (Consumer, Automotive and Transportation, Healthcare, Education, BFSI, Travel and Hospitality, Others)
Statistical Snap of Asia Pacific Wi-Fi Chipset Market
Expansion Analysis of Asia Pacific Wi-Fi Chipset Market
Problems and Obstacles in Asia Pacific Wi-Fi Chipset Market
Competitive Landscape in the Asia Pacific Wi-Fi Chipset Market
Impact of COVID-19 and Demonetization on Asia Pacific Wi-Fi Chipset Market
Details on Current Investment in Asia Pacific Wi-Fi Chipset Market
Competitive Analysis of Asia Pacific Wi-Fi Chipset Market
Prominent Players in the Asia Pacific Wi-Fi Chipset Market
SWOT Analysis of Asia Pacific Wi-Fi Chipset Market
Asia Pacific Wi-Fi Chipset Market Future Outlook and Projections (FY’2024-FY’2033)
Recommendations from Analyst

1. Introduction

1.1. Scope of the report
1.2. Market segment analysis

2. Research Methodology

2.1. Research data source

2.1.1. Secondary Data
2.1.2. Primary Data
2.1.3. SPER’s internal database
2.1.4. Premium insight from KOL’s

2.2. Market size estimation

2.2.1. Top-down and Bottom-up approach

2.3. Data triangulation

3. Executive Summary

4. Market Dynamics

4.1. Driver, Restraint, Opportunity and Challenges analysis

4.1.1. Drivers
4.1.2. Restraints
4.1.3. Opportunities
4.1.4. Challenges

4.2. COVID-19 Impacts of the Asia Pacific Wi-Fi Chipset Market

5. Market variable and outlook

5.1. SWOT Analysis

5.1.1. Strengths
5.1.2. Weaknesses
5.1.3. Opportunities
5.1.4. Threats

5.2. PESTEL Analysis

5.2.1. Political Landscape
5.2.2. Economic Landscape
5.2.3. Social Landscape
5.2.4. Technological Landscape
5.2.5. Environmental Landscape
5.2.6. Legal Landscape

5.3. PORTER’s Five Forces

5.3.1. Bargaining power of suppliers
5.3.2. Bargaining power of buyers
5.3.3. Threat of Substitute
5.3.4. Threat of new entrant
5.3.5. Competitive rivalry

5.4. Heat Map Analysis

6. Competitive Landscape

6.1. Asia Pacific Wi-Fi Chipset Market Manufacturing Base Distribution, Sales Area, Product Type
6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Asia Pacific Wi-Fi Chipset Market

7. Asia Pacific Wi-Fi Chipset Market, By Device (USD Million) 2020-2033

7.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2020-2026
7.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2027-2033
7.3. Tablet
7.4. Connected Home Devices
7.5. Smartphones
7.6. PCS
7.7. Access Point Equipment
7.8. Others

8. Asia Pacific Wi-Fi Chipset Market, By Band (USD Million) 2020-2033

8.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2020-2026
8.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2027-2033
8.3. Single Band
8.4. Dual Band
8.5. Tri Band

9. Asia Pacific Wi-Fi Chipset Market, By Fabrication Technology (USD Million) 2020-2033

9.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2020-2026
9.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2027-2033
9.3. Finfet
9.4. FDSOI CMOS
9.5. Silicon on Insulator
9.6. Sige

10. Asia Pacific Wi-Fi Chipset Market, By Wifi Standard (USD Million) 2020-2033

10.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2020-2026
10.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2027-2033
10.3. 802.11AY
10.4. 802.11AD
10.5. 802.11AX
10.6. 802.11AC
10.7. WAVE 1
10.8. 802.11AC
10.9. WAVE 2
10.10. 802.11B
10.11. 802.11G
10.12. 802.11N

11. Asia Pacific Wi-Fi Chipset Market, By MIMO Configuration (USD Million) 2020-2033

11.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2020-2026
11.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2027-2033
11.3. SU-MIMO
11.4. MU-MIMO
11.5. 1X1 MU-MIMO
11.6. 2X2 MU-MIMO
11.7. 3X3 MU-MIMO
11.8. 4X4 MU-MIMO
11.9. 8X8 MU-MIMO

12. Asia Pacific Wi-Fi Chipset Market, By End User (USD Million) 2020-2033

12.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2020-2026
12.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2027-2033
12.3. Consumer
12.4. Automotive
12.5. Transportation
12.6. Healthcare
12.7. Education
12.8. BFSI
12.9. Travel
12.10. Hospitality
12.11. Others

13. Asia Pacific Wi-Fi Chipset Market Forecast, 2020-2033 (USD Million)

13.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share

14. Asia Pacific Wi-Fi Chipset Market, By Region, 2020-2033 (USD Million)

14.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2020-2026)
14.2. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2027-2033)
14.3. China
14.4. Japan
14.5. India
14.6. South Korea
14.7. Australia
14.8. Indonesia
14.9. Others

15. Company Profile

15.1. Intel Corporation

15.1.1. Company details
15.1.2. Financial outlook
15.1.3. Product summary
15.1.4. Recent developments

15.2. Qualcomm Technologies. Inc

15.2.1. Company details
15.2.2. Financial outlook
15.2.3. Product summary
15.2.4. Recent developments

15.3. ESPRESSIF SYSTEMS (SHANGHAI) CO LTD

15.3.1. Company details
15.3.2. Financial outlook
15.3.3. Product summary
15.3.4. Recent developments

15.4. Broadcom

15.4.1. Company details
15.4.2. Financial outlook
15.4.3. Product summary
15.4.4. Recent developments

15.5. Hitachi

15.5.1. Company details
15.5.2. Financial outlook
15.5.3. Product summary
15.5.4. Recent developments

15.6. Cisco Systems, Inc

15.6.1. Company details
15.6.2. Financial outlook
15.6.3. Product summary
15.6.4. Recent developments

15.7. Microsoft

15.7.1. Company details
15.7.2. Financial outlook
15.7.3. Product summary
15.7.4. Recent developments

15.8. Apple Inc

15.8.1. Company details
15.8.2. Financial outlook
15.8.3. Product summary
15.8.4. Recent developments

15.9. Celeno Communications

15.9.1. Company details
15.9.2. Financial outlook
15.9.3. Product summary
15.9.4. Recent developments

15.10. Taiwan Semiconductor Manufacturing Company Limited

15.10.1. Company details
15.10.2. Financial outlook
15.10.3. Product summary
15.10.4. Recent developments

15.11. STMicroelectronics

15.11.1. Company details
15.11.2. Financial outlook
15.11.3. Product summary
15.11.4. Recent developments

15.12. Others

16. Conclusion

17. List of Abbreviations

18. Reference Links

SPER Market Research’s methodology uses great emphasis on primary research to ensure that the market intelligence insights are up to date, reliable and accurate. Primary interviews are done with players involved in each phase of a supply chain to analyze the market forecasting. The secondary research method is used to help you fully understand how the future markets and the spending patterns look likes.

The report is based on in-depth qualitative and quantitative analysis of the Product Market. The quantitative analysis involves the application of various projection and sampling techniques. The qualitative analysis involves primary interviews, surveys, and vendor briefings. The data gathered as a result of these processes are validated through experts opinion. Our research methodology entails an ideal mixture of primary and secondary initiatives.

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Frequently Asked Questions About This Report

How big is the Asia Pacific Wi-Fi Chipset Market?

Asia Pacific Wi-Fi Chipset Market is projected to reach USD 8919.14 million by 2033, growing at a CAGR of 3.45% during the forecast period.

What is the growth rate of the Asia Pacific Wi-Fi Chipset Market?

Asia Pacific Wi-Fi Chipset Market grew in Market size from 2024. The Market is expected to reach USD 8919.14 million by 2033, at a CAGR of 3.45% during the forecast period.

What is the anticipated CAGR of the Asia Pacific Wi-Fi Chipset Market?

Asia Pacific Wi-Fi Chipset Market CAGR of 3.45% during the forecast period.

How can I get a sample report on the Asia Pacific Wi-Fi Chipset Market?

You can get the sample pages by clicking the link - Click Here

What is the Market size of the Asia Pacific Wi-Fi Chipset Market?

Asia Pacific Wi-Fi Chipset Market size is USD 8919.14 million from 2024 to 2033.

Which segment is expected to Asia Pacific Wi-Fi Chipset Market?

Asia Pacific Wi-Fi Chipset Market is covered By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User.

Which region is expected to have the highest Market share in the Asia Pacific Wi-Fi Chipset Market?

The Asia-Pacific is anticipated to have the highest Market share in the Asia Pacific Wi-Fi Chipset Market.

Who are the key players in Asia Pacific Wi-Fi Chipset Market?

The key players in the Market include Companies Covered Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO, LTD, Broadcom, Hitachi, Cisco Systems, Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics.

What is the conclusion of the Asia Pacific Wi-Fi Chipset Market?

A system-on-chip (SoC) or hardware communication module that enables wireless communication between devices is called a Wi-Fi chipset. Wireless (Wi-Fi) chipsets are widely used in hardware components such external wireless local area network (WLAN) cards and WLAN adapters.